Google is gearing up to revolutionize its Pixel smartphones with the upcoming Pixel 10, set to introduce significant changes to its Tensor chips. Recent reports hint at Google’s shift towards an in-house design on TSMC’s 3nm process, marking a departure from its reliance on Samsung for chip production.
According to insights from Android Authority, the Pixel 10 will feature a new Imagination Technologies DXT GPU, a VeriSilicon DC9000 for display control, and a custom Image Signal Processor (ISP) for enhanced camera performance. Additionally, Google will adopt Chips&Media’s WAVE677DV codec, signaling a departure from its previous codec choices.
Google’s commitment to custom-built components like audio DSP and memory compressors, alongside advancements in the Tensor Processing Unit (TPU) for AI processing, underscores the company’s dedication to optimizing performance and user experience in the Pixel 10.
While the Pixel line has excelled in day-to-day usage, it has lagged behind competitors like Qualcomm in benchmark tests and gaming capabilities. The upcoming Tensor G5 in the Pixel 10 aims to address these performance gaps, particularly with the introduction of a new GPU, potentially enhancing its competitiveness against leading devices like the Galaxy S25 Ultra and OnePlus 13.
The emphasis on refining camera capabilities, a standout feature of the Pixel series, raises expectations for further improvements in image processing with the Pixel 10. Building on the success of the Pixel 9’s camera system, Google’s focus on enhancing photography experiences is a promising aspect of the upcoming device.
As Google pushes boundaries in chip design and performance optimization with the Pixel 10, tech enthusiasts eagerly anticipate how these advancements will elevate the user experience and solidify Google’s position in the competitive smartphone market. Stay tuned for more updates on the Pixel 10 as Google continues to innovate and refine its flagship devices.